| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| KLMBG2JETD-B041 | 存储IC |
SAMSUNG/三星 |
BGA |
20+ |
2210 |
|||
| XCZU2CG-1SFVC784I | 其他被动件 |
XILINX/赛灵思 |
23+ |
300 |
||||
| ADRV9025ABBCZ | IC |
ADI/亚德诺 |
BGA289 |
23+ |
595 |
|||
| SM-8250-0-MPSP1099-TR-02-0-AC | QUALCOMM/高通 |
BGA |
2209 |
10 |
||||
| SM-8350-1-MPSP1393-MT-03-0-AB | QUALCOMM/高通 |
BGA |
2039 |
1 |
||||
| SM-7225-0-PSP837-TR-00-0-AB | QUALCOMM/高通 |
BGA |
2023 |
2000 |
||||
| SM-8250-1-MPSP1017-TR-02-0-AC | QUALCOMM/高通 |
BGA |
21+ |
231 |
||||
| PM6357-001 | QUALCOMM/高通 |
BGA |
2133 |
9 |
||||
| PM-4250-0-FOWNSP144-TR-00-0 | QUALCOMM/高通 |
BGA |
21+ |
2313 |
||||
| MSM8996-3AB | QUALCOMM/高通 |
BGA |
2000 |
|||||
| WTR-2100-0-62WLNSP-HR-07-2 | QUALCOMM/高通 |
BGA |
1326 |
100 |
||||
| SM-7250-1-PSP945-MT-01-0-AC | QUALCOMM/高通 |
BGA |
2126 |
7 |
||||
| SDM630-200-AA | QUALCOMM/高通 |
BGA |
1850 |
20 |
||||
| MSM8937-2AA | QUALCOMM/高通 |
BGA |
19+ |
7 |
||||
| SM6357-100-AB | QUALCOMM/高通 |
BGA |
22+ |
3 |
||||
| SDM-429W-1-575PNSP-MT-01-0-AB | QUALCOMM/高通 |
BGA |
20+ |
2000 |
||||
| WCN-6851-1-1-NSP288-MT-00-0 | QUALCOMM/高通 |
BGA |
20+ |
68 |
||||
| SM-6115-2-NSP752-TR-00-0-AA | QUALCOMM/高通 |
BGA |
21+ |
2000 |
||||
| APQ8084-1EB | 内存芯片 |
QUALCOMM/高通 |
BGA |
1000 |
||||
| R7FA6M1AD3CFM#AA0 | 其他被动件 |
RENESAS/瑞萨 |
LQFP64 |
2309 |
309 |
商家默认展示20条库存